Wire bonder
Au or Al wire is connected to electrodes of micro-fabricated devices.
Specifications
HB10 made by TPT
Mode: Wedge bonding or Ball bonding
Wire width : Au wire for ball bonding（17 µmφ～50 µmφ）
Al wire for wedge bond（17 µmφ～75 µmφ）
Heater stage : 90 mmφ，≦ 250 ˚C
Bonding area : 10 mm x 10 mm